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About Project

Behold, a marvel of engineering designed to tame the heat generated by today's powerful electronics! This pure copper pin fin heat sink, meticulously crafted using Selective Laser Melting (SLM) 3D printing technology, is a testament to both form and function.

Optimized for Performance

The heat sink's rectangular base, featuring rounded edges for a touch of elegance, provides a stable platform for its intricate fin structure. Atop, a precisely arranged grid pattern of pin-head cone-shaped fins maximizes surface area, the key to efficient heat dissipation. This grid-like arrangement ensures even heat distribution, preventing hot spots and promoting optimal thermal performance.

Copper: The Superior Choice

Crafted from pure copper, this heat sink boasts exceptional thermal conductivity, far surpassing that of aluminum. This allows it to rapidly draw heat away from sensitive electronic components, ensuring they operate within safe temperature ranges and prolonging their lifespan. Moreover, copper's inherent antimicrobial properties make this heat sink ideal for applications where hygiene is paramount.

Aesthetics Meet Functionality

The small rectangular tab on the side serves as a secure mounting point, facilitating easy integration into various systems. But this heat sink is not just about performance; it's also a visual delight. The interplay of light and shadow on the precisely formed fins creates a captivating aesthetic, making it a stylish addition to any high-performance device.

FacFox: Your Partner in Pure Copper 3D Printing

Looking to harness the power of pure copper for your next thermal management solution? Look no further than FacFox! Our state-of-the-art 532nm green laser SLM 3D printing technology allows us to create intricate and high-performance copper components like this heat sink with unparalleled precision and quality. Contact us today to explore how FacFox can bring your innovative designs to life!

Solution

• Step 1: CAD Model Design. A detailed 3D computer-aided design (CAD) model of the heat sink was created, specifying the dimensions, geometry, and features.
• Step 2: SLM Print Preparation. The CAD model was converted into a format suitable for SLM printing, and parameters such as layer thickness, laser power, and scan speed were defined.
• Step 3: Powder Bed Preparation. A thin layer of pure copper powder was evenly spread across the build platform within the SLM printer.
• Step 4: Selective Laser Melting. A high-power 532nm green laser was precisely directed to selectively melt and fuse the copper powder according to the CAD model, building the heat sink layer by layer.
• Step 5: Powder Removal. After the printing process was completed, excess copper powder was carefully removed from the build platform, revealing the solidified heat sink.
• Step 6: Support Structure Removal. If any support structures were used during printing, they were carefully detached or dissolved.
• Step 7: Post-Processing. The heat sink was inspected for quality and any necessary post-processing steps were performed, such as surface finishing or heat treatment.
• Step 8: Quality Control. The final product underwent rigorous quality control checks to ensure it met the required specifications and standards.