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GKN Aerospace’s Global Technology Centre installs RenAM 500Q Flex 3D Printer Hardware

Global engineering technologies company, Renishaw, has installed a RenAM 500Q Flex additive manufacturing system at aerospace manufacturer GKN Aerospace’s state-of-the-art Global Technology Centre in Bristol, UK. Taking its place alongside the latest technologies and manufacturing processes for the next generation of aircraft, the RenAM 500Q Flex will provide valuable feedback on how to optimize AM for aerospace applications.

ASICS releases ACTIBREEZE 3D (printed) SANDAL Consumer Products

ASICS Releases ACTIBREEZE 3D (Printed) SANDAL

ASICS has launched its new ACTIBREEZE 3D SANDAL – a 3D printed sandal specifically designed to help the body and mind of a recovering athlete in the ‘After Performance’ phase. The ACTIBREEZE 3D SANDAL features a novel geometric structure, made possible through parametric design and advanced 3D printing technology, to deliver outstanding comfort and protection for the wearer.

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3DEO Adds DfAM as Core Service

Los Angeles-based 3DEO, one of the world’s highest volume metal 3D printing companies, has added design and engineering services to its portfolio of offerings, to better support its customers throughout the entire product lifecycle. 3DEO is introducing advanced end-to-end solutions to product and engineering teams across all industries, specializing in medical devices, industrial equipment, aerospace and consumer products. The decision to include early-stage DfAM in its already differentiated 3D printing technology service gives 3DEO a further advantage to uniquely solve its customers’ needs at any stage of the product development lifecycle – with the ultimate goal of production at scale.

CloudPrint 2.0 released by MakerBot AM Software

CloudPrint 2.0 Released by MakerBot

MakerBot, a company that forms part of the Stratasys portfolio, has released CloudPrint 2.0 – a major upgrade to its print preparation and management solution, MakerBot CloudPrint. MakerBot CloudPrint now includes an enhanced interface for a smoother user experience, and several new and upgraded features that enable users to go from CAD file to 3D printed part faster than before.

Triditive and Foxconn to develop a metal binder jetting AM system 3D Printer Hardware

Triditive and Foxconn to Develop a Metal Binder Jetting AM System

The Taiwanese electronics giant Foxconn has joined forces with the Asturian company Triditive, a global benchmark company in additive manufacturing, to develop a 3D printer leveraging binder jetting technology. For several years, Triditive has been developing and commercializing bound metal extrusion systems tailored for parts production, under the brand AMCELL. Triditive and Foxconn will now work together on further scaling the AM platform’s automated manufacturing capabilities, marking a very important milestone and significant achievement for the Asturian startup led by CEO Mariel Diaz.

Deggendorf Institute of Technology orders MPO 100 printer Industrial Additive Manufacturing

Deggendorf Institute of Technology Orders MPO 100 Printer

The Deggendorf Institute of Technology (DIT) has placed an order for a Multiphoton Optics MPO 100 printer. Multiphoton Optics was awarded the contract shortly before the official market launch of the new multi-user laser direct writer, which is based on Two-Photon Polymerization (TPP), and is produced by parent company Heidelberg Instruments Mikrotechnik GmbH. The MPO 100 will be used in the field of packaging and integrated optics at the Technology Campus (TC) Teisnach Sensor Technology of the DIT.

Deggendorf Institute of Technology orders MPO 100 printer Industrial Additive Manufacturing

The Deggendorf Institute of Technology (DIT) has placed an order for a Multiphoton Optics MPO 100 printer. Multiphoton Optics was awarded the contract shortly before the official market launch of the new multi-user laser direct writer, which is based on Two-Photon Polymerization (TPP), and is produced by parent company Heidelberg Instruments Mikrotechnik GmbH. The MPO 100 will be used in the field of packaging and integrated optics at the Technology Campus (TC) Teisnach Sensor Technology of the DIT.