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Unison to provide additively manufactured air-air heat exchangers for Cessna Denali aircraft Aerospace

by Aerospace

Dayton, Ohio, based Unison Industries announced that it has been selected by Textron Aviation, a Textron Inc company, to provide additively manufactured air-air heat exchangers for the new Cessna Denali high performance single engine turboprop. With a maximum occupancy of 11, the clean sheet Denali single engine turboprop will be powered by GE Aviation’s Advanced Turboprop Engine and is targeted to achieve first flight in 2018.

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Oracle Cloud Applications to Drive Carbon’s Quest to Lead in 3D Printing and AM 3D Printing Processes

by Design

Carbon, whose CLIP (Continuous Liquid Interface Production) technology enables commercial customers to 3D print manufacturing grade components, has selected Oracle Cloud Applications to modernize its systems, transform business processes, and help ensure a secure, scalable, and connected cloud suite for the next phase of the company’s growth. Oracle’s Cloud Applications will enable Carbon to maintain a competitive edge in the dynamic additive manufacturing market by helping to increase business agility, lower costs, and reduce IT complexity.

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Researchers Develop a Geometry-based Model for Predicting Lack-of-Fusion Porosity in PBF 3D Printing Processes

by Design

A study which appeared on the ScienceDirect Journal describes the development of a geometry based model for predicting lack of fusion during metal powder bed fusion processes (SLM, DMLS, EBM). The model relies on melt pool dimension, hatch spacing and layer thickness. The porosity (or density) predicted with the model agrees well with reported literature data on PBF processes.

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OPTIS Releases VR-Ready SPEOS CAD Sim Version 2017 3D Printing Processes

by Design

SPEOS is now HPC and VR-Ready for enhanced design capabilities. OPTIS, a pioneer and global provider of lighting simulation solution for industries, announces the latest version of SPEOS. OPTIS’ flagship software is the only CAD simulation software available to solve the technical challenges of lighting, color and materials with CAD environments. With this latest release, SPEOS is also HPC and VR-Ready, providing a realistic product experience, very quickly.